10 March 1999 Measurement of surface profile of microstructure
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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341284
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
The paper describes the non-contact ultra-high accurate 3D surface profile measuring system for the microstructure, whose surface structure is probably deep and discontinuous. The system is based on the dual-path two-wavelength phase- shifting interferometry and data processing/analysis. To measure the deep microstructure,the generalized two- wavelength measuring method is adopted to expand the depth measuring range. To measure the microstructure whose surface is discontinuous, a new data analysis/processing method is presented, by which the discontinuous surface can be measured without the change of the measuring system. This system has already been applied to measure the surface profile of the various actual microstructures. The results show that the depth resolution of the system is 0.5nm, the depth measuring accuracy is better than 1.3nm. When 20X microscopic lenses is used, the transversal resolution of the system is about 0.5 micrometers , the field is about (phi) 1.325 mm.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mingbao Zhou, Mingbao Zhou, Linbo Bai, Linbo Bai, Zhan Li, Zhan Li, HanMin Yao, HanMin Yao, } "Measurement of surface profile of microstructure", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341284; https://doi.org/10.1117/12.341284

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