10 March 1999 Micro-EDM for silicon microstructure fabrication
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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341274
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
Currently, most silicon microstructures used in microstructures are produced by photolithographic methods. The reason for this is the well-developed etching technology, used in microelectronics, that has been transferred to the microsystem domain. But since the making of an arbitrary shape or angle on silicon mainly depends on the crystal orientation, some severe limits exist in the production of 3D structures. Electro-discharge machining (EDM) is basically a thermal process. During the EDM process material is removed by electric sparking. It is therefore completely different from etching. In this work, micro-EDM is introduce as a potential approach for solving the above mentioned drawbacks. First, this work presents several testing experiments with different process parameters to investigate the influence of the micro-EDM process on the silicon structure. Main emphasis is put on the surface roughness and on avoiding microcracks generated by the sparking process. It is found that microstructures with a sufficiently low surface roughness and with small microcracks can be produced. The remainder of the work concentrates on making small beam structures, which is a common structure in many microsensor designs. It is found that for a wafer thickness of 650 micrometers , the thinnest beam that can be produced is about 30 micrometers wide. This means that micro-EDM can offer an aspect ratio of 20 in combination with a god dimensional control.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiaozhong Song, Xiaozhong Song, Dominiek Reynaerts, Dominiek Reynaerts, Wim Meeusen, Wim Meeusen, Hendrik Van Brussel, Hendrik Van Brussel, } "Micro-EDM for silicon microstructure fabrication", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341274; https://doi.org/10.1117/12.341274


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