10 March 1999 Precision machining using UV and ultrashort-pulse lasers
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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341243
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
This paper gives a survey of the possibilities and limitations concerning precision laser machining of different materials used in microsystems. The presented investigations were performed using 193 nm and 248 nm excimer, frequency converted Nd:YAG and 780 nm Ti:Sapphire femtosecond laser radiation. Besides providing technologies for precise and micro laser machining, the examinations were focused on reducing machining time and costs. The importance of adapted processing techniques, including the use of flexible masks in combination with excimer lasers is presented. Depending on the target material and processing parameters, different machining techniques are discussed. Since one single laser type cannot serve to fulfill all requirements in cutting, material removal, drilling, surface structuring, or metallization, each application asks for a well-considered system choice, and a specific process optimization.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans Kurt Toenshoff, Hans Kurt Toenshoff, Ferdinand von Alvensleben, Ferdinand von Alvensleben, Andreas Ostendorf, Andreas Ostendorf, Guido Willmann, Guido Willmann, Thilo Wagner, Thilo Wagner, } "Precision machining using UV and ultrashort-pulse lasers", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341243; https://doi.org/10.1117/12.341243

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