10 March 1999 Processing of complex microsystems: a micro mass spectrometer
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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341247
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
Abstract
By means of micro structuring the size of a mass spectrometer can be scaled down to about a few cubic centimeters at high precision and reproducibility. Such a miniaturized mass spectrometer is a micro system of very complex nature. It comprises of at least three main parts to be manufactured by micro structuring: an electron source, an ionization region including accelerating and focusing units and a mass analyzer with detector. Since microsystem technologies are 2.5 dimensional - i.e. defined undercuts are difficult to realize - the spectrometer is built of three substrate-layers to achieve the necessary 3D structure. These layers represent the three above mentioned units - each composed of several metal and isolation layers. The substrates are placed cross wise with respect to their electrical connections, so that the top structure can be bonded from below and the bottom structure from the top. The presented layout and processing is adapted to the physical requirements of the system as there are e.g. pressure stages, low capacitance and uncritical assembly, the type of processes and their order are chosen compatible to each other and to the involved materials and structures. This concerns for example the selectivity of etching processes, compatibility of metals, thermal stress, mechanical stress during thick photoresist removal and the thickness of membranes and freestanding structures to survive the mechanical stress imposed during the fabrication.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter Siebert, Peter Siebert, G. Petzold, G. Petzold, Joerg Mueller, Joerg Mueller, } "Processing of complex microsystems: a micro mass spectrometer", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341247; https://doi.org/10.1117/12.341247
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