10 March 1999 Stress-compensated metal stencil masks for selective deposition in microelectronics, micromechanics, and optoelectronics
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Proceedings Volume 3680, Design, Test, and Microfabrication of MEMS and MOEMS; (1999) https://doi.org/10.1117/12.341177
Event: Design, Test, and Microfabrication of MEMS/MOEMS, 1999, Paris, France
Abstract
This paper describes the fabrication of a new type of metal stencil mask. By using electrodeposited (ED) photoresist in an electrophoretic bath, conformal layer is deposited on both sides of a copper foil, making thus possible double side photolithography. After the exposure through two well aligned mask, containing the structure, and the developing of the photoresist, the copper foil is simultaneous selective electroless nickel deposited on both sides, allowing the stress in the sandwich structure nickel films to balance each other. Transmission holes are etched entirely through the copper membrane resulting in an inherent stress compensated metal stencil mask. The attainable 5 micrometers resolution and high reliability offered by stress compensation of this kind of metal stencil, open very exciting possibilities for low costs selective deposition of metals and insulators in microelectronics, micromechanics and optoelectronics.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Niculae Dumbravescu, "Stress-compensated metal stencil masks for selective deposition in microelectronics, micromechanics, and optoelectronics", Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341177; https://doi.org/10.1117/12.341177
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