5 May 1999 Mechanism of creating nanodefects on metal surfaces under load
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Proceedings Volume 3687, International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering; (1999) https://doi.org/10.1117/12.347454
Event: International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering, 1998, St. Petersburg, Russian Federation
Abstract
It was studied mechanism of creating nanodefects on Au and Cu surfaces under load by scanning tunnelic microscopy. The defects look likes a print of triangle prism with angle about 70 degrees. The defects appear, grow and then disappear. If the value of the depth does not reach a critical value (about 20n nm for Au and 15n nm for Cu where n is integer) the time of their life is not more 1 - 10 min. When the depth of the defects reach the critical value, the time of their life increases more than three order. Appearing and evolution of the defects is caused by shift the bands of material width from 5 to 50 nm on several nanometers in direction to planes of easy sliding.
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Victor I. Vettegren, Victor I. Vettegren, Sohibnasar Sh. Rakhimov, Sohibnasar Sh. Rakhimov, Vladimir N. Svetlov, Vladimir N. Svetlov, } "Mechanism of creating nanodefects on metal surfaces under load", Proc. SPIE 3687, International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering, (5 May 1999); doi: 10.1117/12.347454; https://doi.org/10.1117/12.347454
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