This paper describes Boeing's next-generation 320 X 320 uncooled IR focal plane product. The basic objectives have ben to at least double focal plane performance, improve focal pane operating stability, and significantly enhance the control interface between the focal pane and the camera. All of these basic objectives have been achieved. Focal plane temporal NETD equals 0.028 degrees C has been demonstrated at a frame rate of 60 Hz on the first lot of UFPAs produced, as well as a worst-case spatial NETD < 0.016 degrees C measured over 10 degrees C temperature calibration range. Operating stability improvement has been successfully demonstrated. The design has validated a 'smart sensor' UFPA/camera control interface that provides externally programmability of on-chip signal gain, on-chip pixel offset compensation, on-chip detector bias regulation, precision on-chip temperature measurement, and a 16 test- point Built In Test function. Based on Lot-1 test results, the next lot, which is now in wafer processing, is expected to achieve NETD < 0.02 degrees C at a 60 Hz frame rate. With an improved microbolometer Thermal Isolation Structure, currently in development at Boeing, NETD < 0.010 degrees C can be demonstrated before the end of this year.