26 July 1999 FOA/DSTO uncooled IRFPA development
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Abstract
This paper aims to update the progress of the FOA and DSTO collaboration on uncooled microbolometer focal plane arrays and digital readout CMOS electronics, and reports on problems and solutions found in the electronics area. Image result are presented showing the feasibility of the FOA/DSTO concept. This concept utilizes monolithic silicon microbolometers and unique 16-bit on-chip analog-to-digital conversion. The focal plane arrays described in the paper were designed by Electro-optic Sensor Design and post- processed at DSTO on to CMOS readout wafers supplied by FOA. All electronics including the 16-bit ADCs have been proven to function up to the sensors format 320 X 240, using 320 parallel channels of electronics. No significant performance degradation has been observed compared to smaller 16 X 16 arrays. Given detector performance obtainable today and low noise preamplification, the dynamic range supplied by this ADC is sufficient to give an NETD better than 0.1K using 40 micrometers X 40 micrometers pixels and f/1 optics while covering a +/- 5 percent detector mismatch. This is sufficient for most applications but analog offset correction prior to A/D conversion will be necessary to achieve a readout noise lower than the detector Johnson noise.
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Christer Jansson, Christer Jansson, Ulf Ringh, Ulf Ringh, Kevin Charles Liddiard, Kevin Charles Liddiard, Nigel Robinson, Nigel Robinson, } "FOA/DSTO uncooled IRFPA development", Proc. SPIE 3698, Infrared Technology and Applications XXV, (26 July 1999); doi: 10.1117/12.354528; https://doi.org/10.1117/12.354528
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