Thermal engineering of electronics products has become more essential, mainly because of increasing power densities due to the past rate of miniaturization at all assembly levels. One tool, which facilitates this challenging work, is infrared (IR) thermography. With an IR camera, it is often quite easy to quickly inspect an electronic device, or usually printed circuit board (PCB), by detecting and locating possible hot spots. However, due to the relative ease of use of modern IR cameras equipped with diverse special functions, it is also rather easy to make serious misinterpretations. Typical pitfalls that arise in electronics applications include considerable emissivity variations, for instance on common PCB's and the sometimes-drastic changes of operation conditions when the device under test is removed from its operational environment to allow imaging. In this paper, these pitfalls, their effects, and the feasibility of possible remedies are discussed.