26 July 1999 8x8 arrays of VCSEL/CMOS and photodetectors: optoelectronic interconnects
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We demonstrate an optoelectronic interconnect based on an 8 by 8 array of vertical-cavity surface-emitting lasers, an 8 by 8 array of photodetectors, and a single compound lens. The substrate-emitting VCSEL array and back-illuminated photodetector array were flip-chip bonded to a CMOS driver circuit and a Si fan-out pad array, respectively. The CMOS driver provides laser addressing, signal conditioning and modulation current.In this paper we will describe the interconnect configuration, device structures and characteristics, and CMOS driver circuits. We then discuss the system operation and performance.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John T. Pham, John T. Pham, George J. Simonis, George J. Simonis, Jagadeesh Pamulapati, Jagadeesh Pamulapati, William B. Lawler, William B. Lawler, Paul H. Shen, Paul H. Shen, J. Jiang Liu, J. Jiang Liu, Wayne H. Chang, Wayne H. Chang, Peter G. Newman, Peter G. Newman, Monica Alba Taysing-Lara, Monica Alba Taysing-Lara, Bikash Koley, Bikash Koley, Mario Dagenais, Mario Dagenais, } "8x8 arrays of VCSEL/CMOS and photodetectors: optoelectronic interconnects", Proc. SPIE 3714, Enabling Photonic Technologies for Aerospace Applications, (26 July 1999); doi: 10.1117/12.354688; https://doi.org/10.1117/12.354688


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