Raw wafer material control to eliminate low yield

Cheng-Fu Hsu; W. C. Chang; Wei-Kun Yeh; Steve Lin

doi:10.1117/12.346249

23 April 1999 Raw wafer material control to eliminate low yield

Cheng-Fu Hsu, W. C. Chang, Wei-Kun Yeh, Steve Lin

Proceedings Volume 3742, Process and Equipment Control in Microelectronic Manufacturing; (1999) https://doi.org/10.1117/12.346249
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom

Abstract

In the modern VLSI manufacture, the quality of the silicon raw wafer can not be over-emphasized in multilevel integration circuit manufacture. The silicon raw wafers induced low yield issue including particles, contamination residue and IDDQ failure are found in production lots. All these low yield issues are caused by the worse raw wafer vendor hard laser mark. The raw wafer vendor hard laser mark done by the raw wafer supplier on the wafer shows the ingot batch, the substrate type and the supplier company. When the silicon raw wafers are processed in production from wafer start, the worse vendor laser mark will induced some contamination from different process stage and be resulted in low yield issue. After improving the vendor laser mark process in laser mark procedure as well as method, all the low yield issues were recovered.

Citation Download Citation

Cheng-Fu Hsu, W. C. Chang, Wei-Kun Yeh, and Steve Lin "Raw wafer material control to eliminate low yield", Proc. SPIE 3742, Process and Equipment Control in Microelectronic Manufacturing, (23 April 1999); https://doi.org/10.1117/12.346249

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