27 April 1999 Impact of built-in film thickness measurement in CMP process
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CMP is now the planarization method of choice in semiconductor manufacturing. However, CMP is still an immature process. Problems still exist with the uniformity and the stability of the CMP rate. These process variations stem from an incomplete understanding of the mechanism of CMP and the variation of CMP consumable s like slurry, pad and backing film. To compensate for these variations, send- ahead processing and too many measurements are usually required. Obviously, these affect CMP productivity. For better CMP productivity and accurate film thickness control, in-process monitoring is a promising solution. In this paper, a CMP tool with built-in thickness measurement is presented. Such a built-in CMP film thickness monitor must satisfy several requirements: 1) the measurements need to be made at specified chips in the wafer and at specified sites in the chip, 2) the measurements should be accurate, 3) multiple film stack measurements must be possible and 4) high-speed measurements must be possible. These four issues of the built-in film thickness monitor are discussed.
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Hiroyuki Yano, Hiroyuki Yano, Katsuya Okumura, Katsuya Okumura, Noriyuki Kondo, Noriyuki Kondo, Masahiro Horie, Masahiro Horie, } "Impact of built-in film thickness measurement in CMP process", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); doi: 10.1117/12.346938; https://doi.org/10.1117/12.346938


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