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27 April 1999 Kill ratio calculation for in-line yield prediction
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The search for better yields in IC manufacturing calls for a smarter use of the vast amount of data that can be generated by a world class production line.In this scenario, in-line inspection processes produce thousands of wafer maps, number of defects, defect type and pictures every day. A step forward is to correlate these with the other big data- generator area: test. In this paper, we present how these data can be put together and correlated to obtain a very useful yield predicting tool. This correlation will first allow us to calculate the kill ratio, i.e. the probability for a defect of a certain size in a certain layer to kill the die. Then we will use that number to estimate the cosmetic yield that a wafer will have.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alfonso Lorenzo, David Oter, Sergio Cruceta, Juan Francisco Valtuena, Gerardo Gonzalez, and Carlos Mata "Kill ratio calculation for in-line yield prediction", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999);

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