27 April 1999 Kill ratio calculation for in-line yield prediction
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Abstract
The search for better yields in IC manufacturing calls for a smarter use of the vast amount of data that can be generated by a world class production line.In this scenario, in-line inspection processes produce thousands of wafer maps, number of defects, defect type and pictures every day. A step forward is to correlate these with the other big data- generator area: test. In this paper, we present how these data can be put together and correlated to obtain a very useful yield predicting tool. This correlation will first allow us to calculate the kill ratio, i.e. the probability for a defect of a certain size in a certain layer to kill the die. Then we will use that number to estimate the cosmetic yield that a wafer will have.
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Alfonso Lorenzo, Alfonso Lorenzo, David Oter, David Oter, Sergio Cruceta, Sergio Cruceta, Juan Francisco Valtuena, Juan Francisco Valtuena, Gerardo Gonzalez, Gerardo Gonzalez, Carlos Mata, Carlos Mata, } "Kill ratio calculation for in-line yield prediction", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); doi: 10.1117/12.346923; https://doi.org/10.1117/12.346923
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