27 April 1999 Use and function of TXRF (total reflection x-ray fluorescence) for routine in fab metallic monitoring
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Abstract
As the geometries of semiconductors shrink the sensitivity to metal contamination becomes more apparent. This makes the ability to detect a broad range of metals at levels form 108 to 109 at/cm2 very important. The advent of Copper processing in many cleanrooms also raises the concern of cross-contamination and highlights the need for a fast, sensitive, and easy to use detection tool. The use of a TXRF machine in the silicon wafer fabrication area provides the ability to measure metals at levels ranging from 5E11 to 1E9 at/cm2 without multiple processing steps.
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Mike Allen, Mike Allen, Tim Z. Hossain, Tim Z. Hossain, Joseph Lebowitz, Joseph Lebowitz, } "Use and function of TXRF (total reflection x-ray fluorescence) for routine in fab metallic monitoring", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); doi: 10.1117/12.346909; https://doi.org/10.1117/12.346909
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