25 August 1999 Semiconductor technology trend and requirements for masks
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Proceedings Volume 3748, Photomask and X-Ray Mask Technology VI; (1999) https://doi.org/10.1117/12.360190
Event: Photomask and X-Ray Mask Technology VI, 1999, Yokohama, Japan
Abstract
The fabrication cost of the semiconductor device is increasing because the fabrication cost per wafer unit area and the mask cost are increasing rapidly with the design rule decreased. The rapid increase in the mask cost will influence the semiconductor industry growth. The progress in the lithography, including the mask, is the key issue for the progress in the entire semiconductor technology beyond 180 nm design rule, because the mask is indispensable for any types of lithography, and is regarded as one of the most critical technologies, both in resolution and productivity. To continue the progress in the entire semiconductor technology and the growth of the semiconductor business, it is indispensable to make challenges in the low cost and high precision mask technology under the cooperation with related industries and academia. It is especially important to develop the cost optimum solution for the total lithography technology including masks.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hiroyoshi Komiya, Hiroyoshi Komiya, } "Semiconductor technology trend and requirements for masks", Proc. SPIE 3748, Photomask and X-Ray Mask Technology VI, (25 August 1999); doi: 10.1117/12.360190; https://doi.org/10.1117/12.360190
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