The semiconductor industry utilizes complex patterning tools to achieve the patterning of fine features. These tools require stiff, lightweight, dimensionally stable components in order to reliably pattern photomasks and wafers. Traditionally, these tools have used metals, ceramics, and low expansion glasses. However, a new class of materials, high performance composites, have demonstrated promise for replacing these materials. This paper discusses the design, manufacturing, and test of a carbon fiber composite stage component of an electron beam lithography tool.