Paper
10 June 1999 New polymeric materials for designing photoresistors and photodetective assemblies based on CdHgTe
L. M. Khitrova, Y. S. Troshkin, V. P. Belyaev, G. E. Popovyan, L. V. Kiseleva
Author Affiliations +
Proceedings Volume 3819, International Conference on Photoelectronics and Night Vision Devices; (1999) https://doi.org/10.1117/12.350901
Event: International Conference on Photoelectronics and Night Vision Devices, 1998, Moscow, Russian Federation
Abstract
In order to improve quality of photodetectors and photodetective assemblies two new cryo- and chemically resistant adhesives were developed: epoxy-silico-organic adhesive `(Phi) X-5P' and acrylic `OPHOH-2' adhesive for gluing of CdHgTe wafers to a substrate `XCK-H' vacuum-tight modified adhesive is used for attaching of inlet windows and glass holder elements. `OPUOH-65' vibration damping thixotropic composition was developed for mounting of multi- layer printed circuits.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
L. M. Khitrova, Y. S. Troshkin, V. P. Belyaev, G. E. Popovyan, and L. V. Kiseleva "New polymeric materials for designing photoresistors and photodetective assemblies based on CdHgTe", Proc. SPIE 3819, International Conference on Photoelectronics and Night Vision Devices, (10 June 1999); https://doi.org/10.1117/12.350901
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KEYWORDS
Polymers

Adhesives

Photoresistors

Chemical elements

Optical instrument design

Semiconducting wafers

Glasses

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