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20 September 1999 Ablation of solid targets with UV femtosecond pulses
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Proceedings Volume 3822, Computer-Controlled Microshaping; (1999)
Event: Industrial Lasers and Inspection (EUROPTO Series), 1999, Munich, Germany
Ablation of submicron structures on metals and semiconductors is presented using subpicosecond laser pulses at 248 nm. Morphology changes as a function of pulse duration have been investigated. The dynamics of the surface modification has been studied using a pump-probe technique. Diffracted signals of a probe beam on laser induced gratings provide information on the dynamics of the electron phonon interaction, melting and material removal simultaneously. For metals, in the first 5 - 10 ps following irradiation the electron-phonon relaxation dominates the process, followed by melting, expansion and violent material ejection. For semiconductors, rapid amorphization of the surface occurs within a couple of hundred femtoseconds following irradiation, with less pronounced indication for the development of molten material.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter Simon, Juergen Ihlemann, Jan-Hendrik Klein-Wiele, Jozsef Bekesi, and Gerd Marowsky "Ablation of solid targets with UV femtosecond pulses", Proc. SPIE 3822, Computer-Controlled Microshaping, (20 September 1999);

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