Translator Disclaimer
30 December 1999 Cost analysis of 4x and 6x 9-in. reticles for future lithography
Author Affiliations +
Standardizing on reticle size is critical for semiconductor tool manufacturers and the semiconductor industry as a whole. The advantages of large reticles are well known: larger die and increased throughput. Although predictions of extremely large die have not yet been realized, the throughput implications remain valid. As large reticles have the potential to increase throughput, some proponents view them as potential cost savers. This work examines the implications of migrating from today's standard 6-inch reticles to 9-inch reticles. It explores the factors that drive reticle cost, and describes why larger reticles should cost more. The paper also describes the cost benefit of implementing larger masks. Comparing the expected cost of building the reticle to the potential cost savings of using the reticle in production provides significant insight into the problem of selecting the optimal reticle size. Finally, the paper presents an analysis of the impact of 6X reduction systems on the selection of reticle size.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lloyd C. Litt, Michael E. Kling, and Terry Perkinson "Cost analysis of 4x and 6x 9-in. reticles for future lithography", Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999);


Mask making: today's enabling technology
Proceedings of SPIE (December 07 1994)
Developing loading effect on lithography I-line process
Proceedings of SPIE (December 04 2008)
In the end it's the bottom line that counts
Proceedings of SPIE (May 20 2004)
Sizing the next generation of optical photomasks
Proceedings of SPIE (July 03 1995)

Back to Top