30 December 1999 Die-to-die and die-to-database capability analysis for advanced OPC inspection
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Abstract
With design rules continuing to shrink down to 0.18 micrometer and beyond, various small OPC features have been used more and more by the semiconductor industry to increase the process latitude depth of focus), preserve the printing pattern fidelity on the wafer and extend the lifetime of photolithography technology. These various sub resolution OPC features directly challenge the inspection capability of the most advanced inspection systems. Die to die and die to database inspection capabilities must be characterized. A comprehensive 'HellOPC' test mask has been designed and developed for the OPC inspection evaluation. We have evaluated the OPC inspection capability of various OPC features for four technology levels that are 0.25 micrometer, 0.225 micrometer, 0.18 micrometer and 0.15 micrometer with Die to Die and Die to Database modes with this 'HellOPC' test mask. Runability (runability equals inspectability) maps for various technology levels and various OPC sizes have been presented. The results showed die to die inspection capability is much better than die to database for the advanced OPC inspection. The APA on KLA351 and the AOP215 on KLA353 have been evaluated in this work.
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Jerry Xiaoming Chen, Jerry Xiaoming Chen, Drew R. Russell, Drew R. Russell, Robert Terhune, Robert Terhune, John Riddick, John Riddick, Franklin D. Kalk, Franklin D. Kalk, Kevin D. Lucas, Kevin D. Lucas, Bradley J. Falch, Bradley J. Falch, } "Die-to-die and die-to-database capability analysis for advanced OPC inspection", Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999); doi: 10.1117/12.373358; https://doi.org/10.1117/12.373358
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