30 December 1999 Fabrication of membrane mask for next-generation lithography
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Membrane masks are commonly adopted for the next generation lithography (NGL) such as proximity X-ray lithography (XRL), ion beam projection lithography (IPL), and SCALPEL. Since the NGL membrane masks have lower mechanical stability than the conventional optical mask, it is necessary to study the distortions of membrane masks during mask fabrication and application. Using various kinds of test patterns such as line and space patterns, contact hole arrays, rectangular island arrays, and square island arrays, the mechanical stiffness changes due to pattern transfer were investigated. The in- plane distortions of the membrane mask due to pattern transfer during mask fabrication are dependent on not only void fraction but also pattern shapes. The membrane masks with various kinds of patterns were fabricated and the in-plane distortions were measured.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dong-Wan Kim, Dong-Wan Kim, Jared D. Lera, Jared D. Lera, Hanku Cho, Hanku Cho, Joo-Tae Moon, Joo-Tae Moon, } "Fabrication of membrane mask for next-generation lithography", Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999); doi: 10.1117/12.373320; https://doi.org/10.1117/12.373320


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