Meeting the latest requirements of aggressive users for the advanced mask for optical lithography will be difficult. In addition, improving the productivity and throughput of the advanced mask with high-density pattern data is necessary. To overcome these hurdles, Toshiba Corp. and Toshiba Machine Co., Ltd. have developed the new advanced mask writer, the EBM- 3000, shown in Figure 1. The EBM-3000 especially takes measures against airborne contamination in the load-lock chamber. Three components of the mask blank handling system have a function as mini environment. To link each of these components, it also employs a standard mechanical interface, SMIF, based on the concept of local cleaning technology. This paper is intended to describe the design concept of the new mask blank handling system for the EBM-3000, and prove these measures to be effective against airborne contamination by the experimental results.