Paper
30 December 1999 Next-generation lithography mask development at the NGL Mask Center of Competency
Michael J. Lercel, Cameron J. Brooks, Kenneth C. Racette, Christopher Magg, Mark Lawliss, Neal Caldwell, Raymond Jeffer, Kevin W. Collins, Monica Barrett, Steven C. Nash, Michael J. Trybendis, Lucien Bouchard
Author Affiliations +
Abstract
Mask fabrication is one of the difficult challenges with all Next Generation Lithography (NGL) technologies. X-ray, e-beam projection, and ion-beam projection lithography all use some form of membrane mask, and extreme ultraviolet (EUV) lithography uses a reflective mask. Despite some differences, the various mask technologies share some common features and present similar fabrication difficulties. Over the past several years, the IBM Advanced Mask Facility (AMF) has focused on the fabrication of x-ray masks. Several key accomplishments have been demonstrated including fabricating masks with critical dimensions (CD) as small as 75 nm, producing line monitor masks in a pilot line mode to evaluate mask yields, and fabricating masks to make working microprocessors with the gate level defined by x-ray lithography. The experience on fabricating 1X x-ray masks is now being applied to the other NGL mask technologies. Progress on membrane and absorber materials can be applied to all the technologies, and patterning with advanced e-beam writing with chemically amplified resists utilizes learning from writing and baking on x-ray membrane masks.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael J. Lercel, Cameron J. Brooks, Kenneth C. Racette, Christopher Magg, Mark Lawliss, Neal Caldwell, Raymond Jeffer, Kevin W. Collins, Monica Barrett, Steven C. Nash, Michael J. Trybendis, and Lucien Bouchard "Next-generation lithography mask development at the NGL Mask Center of Competency", Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999); https://doi.org/10.1117/12.373374
Lens.org Logo
CITATIONS
Cited by 5 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Photomasks

X-rays

Critical dimension metrology

Etching

Semiconducting wafers

Electron beam lithography

Silicon

RELATED CONTENT

SNR200 chemically amplified resist optimization
Proceedings of SPIE (July 07 1997)
Image size control in next generation lithography masks
Proceedings of SPIE (July 21 2000)
A new ZEP520 P(MMA MAA) ZEP520 trilayer process for T...
Proceedings of SPIE (January 27 2005)
SOR Lithography in West Germany
Proceedings of SPIE (August 01 1989)

Back to Top