PROCEEDINGS VOLUME 3874
SYMPOSIUM ON MICROMACHINING AND MICROFABRICATION | 20-22 SEPTEMBER 1999
Micromachining and Microfabrication Process Technology V
IN THIS VOLUME

9 Sessions, 45 Papers, 0 Presentations
SSM/Bulk  (5)
Section  (4)
Other  (4)
Lithography  (6)
SYMPOSIUM ON MICROMACHINING AND MICROFABRICATION
20-22 September 1999
Santa Clara, CA, United States
LIGA/Plating/Molding/Casting
Proc. SPIE 3874, Breaking the barriers to commercialization of MEMS: a firm's search for competitive advantage, 0000 (30 August 1999); doi: 10.1117/12.361205
Proc. SPIE 3874, LIGA: metals, plastics, and ceramics, 0000 (30 August 1999); doi: 10.1117/12.361216
Proc. SPIE 3874, Fabrication of plastic microparts on wafer level, 0000 (30 August 1999); doi: 10.1117/12.361226
Proc. SPIE 3874, Innovations in molding technologies for microfabrication, 0000 (30 August 1999); doi: 10.1117/12.361237
Laser Processing
Proc. SPIE 3874, Submicron patterning of aluminum films by laser ablation, 0000 (30 August 1999); doi: 10.1117/12.361248
Proc. SPIE 3874, Femtosecond-pulse laser ablation and surface microstructuring of aluminum alloy 2024, 0000 (30 August 1999); doi: 10.1117/12.361249
Proc. SPIE 3874, Pulsed-laser-deposited coatings for stiction and wear reduction in MEMS devices, 0000 (30 August 1999); doi: 10.1117/12.361206
Proc. SPIE 3874, Excimer laser micromachining of structures using SU-8, 0000 (30 August 1999); doi: 10.1117/12.361208
SSM/Bulk
Proc. SPIE 3874, Materials characterization for MEMS: a comparison of uniaxial and bending tests, 0000 (30 August 1999); doi: 10.1117/12.361209
Proc. SPIE 3874, Reproducibility data on SUMMiT, 0000 (30 August 1999); doi: 10.1117/12.361210
Proc. SPIE 3874, Processing variables for the reduction of stiction on MEMS devices, 0000 (30 August 1999); doi: 10.1117/12.361211
Proc. SPIE 3874, Standard postprocessing technique for fabrication of large microsuspended structures in CMOS, 0000 (30 August 1999); doi: 10.1117/12.361212
Proc. SPIE 3874, Which etchant used and whether an etching mask exists: how they make differences on convex-corner undercutting configuration and compensation criteria, 0000 (30 August 1999); doi: 10.1117/12.361213
Section
Proc. SPIE 3874, Fabrication of counter electrodes for scanning atomic probe, 0000 (30 August 1999); doi: 10.1117/12.361214
Proc. SPIE 3874, W-coating for MEMS, 0000 (30 August 1999); doi: 10.1117/12.361215
Proc. SPIE 3874, Laser welding: providing alignment precision and accuracy to substrate-level packaging, 0000 (30 August 1999); doi: 10.1117/12.361217
Proc. SPIE 3874, Ion beam sputter deposition of TiNi shape memory alloy thin films, 0000 (30 August 1999); doi: 10.1117/12.361219
Mixed Technologies/Integration
Proc. SPIE 3874, Integration issues for pressure sensors, 0000 (30 August 1999); doi: 10.1117/12.361220
Proc. SPIE 3874, Novel fabrication and simple hybridization of exotic material MEMS, 0000 (30 August 1999); doi: 10.1117/12.361221
High-aspect Ratio
Proc. SPIE 3874, Mechanical properties of boron-doped single-crystal silicon microstructures, 0000 (30 August 1999); doi: 10.1117/12.361222
Proc. SPIE 3874, New sensor for real-time trench depth monitoring in micromachining applications, 0000 (30 August 1999); doi: 10.1117/12.361223
Proc. SPIE 3874, Deep anisotropic ICP plasma etching designed for high-volume MEMS manufacturing, 0000 (30 August 1999); doi: 10.1117/12.361224
Proc. SPIE 3874, High-speed laser chemical vapor deposition of amorphous carbon fibers, stacked conductive coils, and folded helical springs, 0000 (30 August 1999); doi: 10.1117/12.361225
Proc. SPIE 3874, EFAB: low-cost automated electrochemical batch fabrication of arbitrary 3D microstructures, 0000 (30 August 1999); doi: 10.1117/12.361227
Proc. SPIE 3874, SCALPEL mask blank fabrication, 0000 (30 August 1999); doi: 10.1117/12.361228
Other
Proc. SPIE 3874, Porous silicon process for encapsulated single-crystal surface-micromachined microstructures, 0000 (30 August 1999); doi: 10.1117/12.361229
Proc. SPIE 3874, Various uses of ion chromatography in the manufacture of MEMS, 0000 (30 August 1999); doi: 10.1117/12.361230
Proc. SPIE 3874, Effects of metal impuritites on the etch rate selectivity of (110)/(111) in (110) Si anisotropic etching, 0000 (30 August 1999); doi: 10.1117/12.361231
Proc. SPIE 3874, Fabrication and reliability testing of Ti/TiN heaters, 0000 (30 August 1999); doi: 10.1117/12.361232
Lithography
Proc. SPIE 3874, Resolution enhancement techniques for submicron deep trench processes, 0000 (30 August 1999); doi: 10.1117/12.361233
Proc. SPIE 3874, Economic fabrication of microscale features in thick resists using scanning projection lithography, 0000 (30 August 1999); doi: 10.1117/12.361234
Proc. SPIE 3874, Development behavior of irradiated foils and microstructures, 0000 (30 August 1999); doi: 10.1117/12.361235
Proc. SPIE 3874, New fabrication methodology for fine-feature high-aspect-ratio structures made from high-Z materials, 0000 (30 August 1999); doi: 10.1117/12.361236
Proc. SPIE 3874, Thick photoresist imaging using a three-wavelength exposure stepper, 0000 (30 August 1999); doi: 10.1117/12.361238
Proc. SPIE 3874, High-aspect-ratio two-dimensional silicon subwavelength gratings fabricated by fast atom beam etching, 0000 (30 August 1999); doi: 10.1117/12.361239
Poster Session
Proc. SPIE 3874, New electromagnetic micromotor with a large torque, 0000 (30 August 1999); doi: 10.1117/12.361240
Proc. SPIE 3874, Micropattern fabrication by a specially designed microtool, 0000 (30 August 1999); doi: 10.1117/12.361241
Proc. SPIE 3874, Multidimensional calculation of coupled flow and electrodeposition in microscopic trenches, 0000 (30 August 1999); doi: 10.1117/12.361242
Proc. SPIE 3874, New design methodologies in (111)-oriented silicon wafers, 0000 (30 August 1999); doi: 10.1117/12.361243
Proc. SPIE 3874, Evidence of dislocations for the control of roughness of highly thermal boron-doped diffused silicon layers, 0000 (30 August 1999); doi: 10.1117/12.361244
Proc. SPIE 3874, Etch-stop in germanium induced by ion implantation for bulk micromachining applications in the IR domain, 0000 (30 August 1999); doi: 10.1117/12.361245
Proc. SPIE 3874, Doping and structural properties for the phosphorous-doped polysilicon layers used for micromechanical applications, 0000 (30 August 1999); doi: 10.1117/12.361246
Proc. SPIE 3874, Fabrication of pop-up detector arrays on Si wafers, 0000 (30 August 1999); doi: 10.1117/12.361247
LIGA/Plating/Molding/Casting
Proc. SPIE 3874, Electrokinetic microfluidic systems, 0000 (30 August 1999); doi: 10.1117/12.361207
Proc. SPIE 3874, 3D silicon photonic lattices: cornerstone of an emerging photonics revolution, 0000 (30 August 1999); doi: 10.1117/12.361218
Back to Top