30 August 1999 Economic fabrication of microscale features in thick resists using scanning projection lithography
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Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361234
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
The commercialization of microfabricated devices requires an efficient, high yield manufacturing process. This paper demonstrates that the extension of scanning projection lithography into the manufacture of microscale devices presents an opportunity to develop cost effective processes. The use of thick dry film resists is a well characterized process. The technology associated with lamination and development is fully commercialized, and the process requirements for exposure allow great operational flexibility. Examples of the use of this technology to form microscale typical of MEMS devices are presented for a resists thickness of 30 micrometers . Microphotographs of the resulting features are presented, and the achievable resolutions and wall angles are quantified. An analysis of process economics for using thick film resists to generate MEMS feature at a commercially viable scale is presented. The factors influencing throughput are discussed, and the potential advantage of using a scanning projection tool with these resists is presented.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marvin M. Kilgo, Marvin M. Kilgo, Charles N. Williams, Charles N. Williams, Dan Constantinide, Dan Constantinide, } "Economic fabrication of microscale features in thick resists using scanning projection lithography", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); doi: 10.1117/12.361234; https://doi.org/10.1117/12.361234
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