Paper
30 August 1999 Materials characterization for MEMS: a comparison of uniaxial and bending tests
George C. Johnson, Peter T. Jones, Roger T. Howe
Author Affiliations +
Proceedings Volume 3874, Micromachining and Microfabrication Process Technology V; (1999) https://doi.org/10.1117/12.361209
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
A wide range of techniques have been developed recently for testing the mechanical properties of materials used in MEMS. Many of these techniques focus on uniaxial tension testing, while others address bending or torsional modes of deformation. This paper compares the two primary modes of testing - uniaxial tension and bending - in terms of the associated forces, deflections and sensitivities to uncertainty in geometry and loading. When determining elastic modulus, the bending test is shown to be more sensitive to uncertainties in beam cross section than is the tension test. On the other hand, in connection with strength characterization it is shown that small deviations form ideal uniaxial loading, either in terms of an offset from the neutral axis or an angular misalignment from the axis, can result in a large decrease in the apparent strength. Bending test for strength determination do not suffer such dramatic effects due to the misalignment of the applied loading.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
George C. Johnson, Peter T. Jones, and Roger T. Howe "Materials characterization for MEMS: a comparison of uniaxial and bending tests", Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); https://doi.org/10.1117/12.361209
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Cited by 14 scholarly publications.
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KEYWORDS
Microelectromechanical systems

Failure analysis

Material characterization

Metrology

Actuators

Error analysis

Sensors

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