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3 September 1999 Fabrication of x-ray phase masks for sub-70-nm imaging
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Proceedings Volume 3875, Materials and Device Characterization in Micromachining II; (1999)
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
A more robust XPM with improved thermal and radiation stability was designed and fabricated in CNTech. The effectiveness of this design is demonstrated and XPM fabrication processing is optimized to obtain finer control over the processing, low stress membrane and vertical sidewall in the phase-shifter materials. The XPM testing indicates that this XPM design is able to readily generating sub-100 nm feature in large volume under a much larger and more manageable gap between mask and wafer (20 - 30 micrometers ). 70 nm lines were printed with UV 5 under 25 micrometers mask-to- wafer gap. The simplicity of this design and the intrinsic multiple mask reduction ratio instead of 1:1 for conventional X-ray mask provide an easy analytical tool for this community to study lithographic performance in 50-to-70 nm region.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lei Yang, Yuli Vladimirsky, and James Welch Taylor "Fabrication of x-ray phase masks for sub-70-nm imaging", Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999);

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