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3 September 1999 Interferometric measurement for improved understanding of boundary effects in micromachined beams
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Proceedings Volume 3875, Materials and Device Characterization in Micromachining II; (1999) https://doi.org/10.1117/12.360480
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
Micromachined beams are commonly used to measure material properties in MEMS. Such measurements are complicated by the fact that boundary effects at the ends of the beams have a significant effect on the properties being measured. In an effort to improve the accuracy and resolution of such measurements, we are conducting a study of support post compliances in cantilever and fixed-fixed beams. Three different support post designs have been analyzed by finite element modeling. The results are then compared to measurements made on actual devices using interferometry. Using this technique, the accuracy of measurements of Young's modulus has been improved. Continuing work will also improve the measurement of residual stress.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Brian D. Jensen, Fernando Bitsie, and Maarten P. de Boer "Interferometric measurement for improved understanding of boundary effects in micromachined beams", Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); https://doi.org/10.1117/12.360480
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