Paper
3 September 1999 Relationship between internal stress and deformation of diaphragm at elevated temperatures using SEM
Akira Yamashita, Yuichi Sakai, Tsukasa Matsuura, Kazuhiko Tsutsumi
Author Affiliations +
Proceedings Volume 3875, Materials and Device Characterization in Micromachining II; (1999) https://doi.org/10.1117/12.360470
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
This paper reports a study of the relationship between internal stress and deformation of diaphragm at elevated temperatures using scanning electron microscope. It is necessary to make a flat diaphragm in order to obtain good performance for various diaphragm-type sensors using heat transfer, such as flow sensors and accelerometers. When these sensors are used in high temperature environments, a flat diaphragm is required. Therefore, it is very important to observe and control the deformation behavior of a diaphragm at various temperatures. As far as we know, few results have been reported on the observation of deformed diaphragms at elevated temperatures.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Akira Yamashita, Yuichi Sakai, Tsukasa Matsuura, and Kazuhiko Tsutsumi "Relationship between internal stress and deformation of diaphragm at elevated temperatures using SEM", Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); https://doi.org/10.1117/12.360470
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KEYWORDS
Scanning electron microscopy

Sensors

Temperature metrology

Resistance

Silicon

Platinum

Micromachining

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