3 September 1999 Small-area in-situ MEMS test structure to measure fracture strength by electrostatic probing
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Proceedings Volume 3875, Materials and Device Characterization in Micromachining II; (1999) https://doi.org/10.1117/12.360459
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
We have designed, fabricated, tested and modeled a first generation small area test structure for MEMS fracture studies by electrostatic rather than mechanical probing. Because of its small area, this device has potential applications as a lot monitor of strength of fatigue of the MEMS structural material. By matching deflection versus applied voltage data to a 3D model of the test structure, we develop high confidence that the local stresses achieved in the gage section are greater than 1 GPa. Brittle failure of the polycrystalline silicon was observed.
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Maarten P. de Boer, Maarten P. de Boer, Brian D. Jensen, Brian D. Jensen, Fernando Bitsie, Fernando Bitsie, } "Small-area in-situ MEMS test structure to measure fracture strength by electrostatic probing", Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); doi: 10.1117/12.360459; https://doi.org/10.1117/12.360459
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