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31 August 1999 Additive electroplating technology as a new integration concept for MEMS
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Proceedings Volume 3876, Micromachined Devices and Components V; (1999) https://doi.org/10.1117/12.360494
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
This paper reports on a new integration concept for MEMS based on an Additive Electroplating Technology (AET). This technology allows the integration of fixed and movable electroplated microstructure on top of a standard ASIC by a low temperature back-end process. The basic fabrication sequence of the AET including aspects of a first level packaging will be presented. Various examples of novel MEMS for automotive and medical applications will show the capability and the limitations of this integration concept.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Josef Binder and Wolfgang Benecke "Additive electroplating technology as a new integration concept for MEMS", Proc. SPIE 3876, Micromachined Devices and Components V, (31 August 1999); https://doi.org/10.1117/12.360494
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