Advances in MEMS using SFB and DRIE technology

Bert P. Van Drieenhuizen

doi:10.1117/12.360510

31 August 1999 Advances in MEMS using SFB and DRIE technology

Bert P. Van Drieenhuizen

Proceedings Volume 3876, Micromachined Devices and Components V; (1999) https://doi.org/10.1117/12.360510
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

The combination of aligned silicon fusion bonding (SFB) with deep reactive ion etching (DRIE) is a flexible technology platform that can be used to fabricate complex multi-layer MEMS services. Silicon wafers can be processed separately and subsequently aligned and bonded and further processed. DRIE technology enables very deep (through-wafer) silicon etching with high-aspect-ratio beams and trenches (1:20), using standard resist masks. DRIE technology can be used in combination with a buried cavity, etched into the bottom substrate before boding, to fabricate a suspended microstructure. Based on this technology platform, a multi- level microfluidics board, thermal actuators, a microvalve, and a high sensitivity accelerometer have been designed, fabricated, and tested.

Citation Download Citation

Bert P. Van Drieenhuizen "Advances in MEMS using SFB and DRIE technology", Proc. SPIE 3876, Micromachined Devices and Components V, (31 August 1999); https://doi.org/10.1117/12.360510

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