31 August 1999 Advances in MEMS using SFB and DRIE technology
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Proceedings Volume 3876, Micromachined Devices and Components V; (1999) https://doi.org/10.1117/12.360510
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
The combination of aligned silicon fusion bonding (SFB) with deep reactive ion etching (DRIE) is a flexible technology platform that can be used to fabricate complex multi-layer MEMS services. Silicon wafers can be processed separately and subsequently aligned and bonded and further processed. DRIE technology enables very deep (through-wafer) silicon etching with high-aspect-ratio beams and trenches (1:20), using standard resist masks. DRIE technology can be used in combination with a buried cavity, etched into the bottom substrate before boding, to fabricate a suspended microstructure. Based on this technology platform, a multi- level microfluidics board, thermal actuators, a microvalve, and a high sensitivity accelerometer have been designed, fabricated, and tested.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bert P. Van Drieenhuizen, Bert P. Van Drieenhuizen, } "Advances in MEMS using SFB and DRIE technology", Proc. SPIE 3876, Micromachined Devices and Components V, (31 August 1999); doi: 10.1117/12.360510; https://doi.org/10.1117/12.360510

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