19 August 1999 Fabrication of polymer high-aspect-ratio structures with hot embossing for microfluidic applications
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Proceedings Volume 3877, Microfluidic Devices and Systems II; (1999) https://doi.org/10.1117/12.359323
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
In this paper we present the fabrication technologies necessary for the high volume production of microfluidic devices, with specific emphasis on the hot embossing process and the parameters necessary for achieving high aspect ratio structures on substrate like polymethylmetacrylate or polycarbonate. In addition to the replication technology, we have investigated subsequent process steps like via hole drilling, bonding and dicing. Several examples for different microfluidic applications will be given.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Holger Becker, Holger Becker, Ulf Heim, Ulf Heim, O. Roetting, O. Roetting, } "Fabrication of polymer high-aspect-ratio structures with hot embossing for microfluidic applications", Proc. SPIE 3877, Microfluidic Devices and Systems II, (19 August 1999); doi: 10.1117/12.359323; https://doi.org/10.1117/12.359323
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