2 September 1999 Finite element modeling of micromachined MEMS photon devices
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Proceedings Volume 3878, Miniaturized Systems with Micro-Optics and MEMS; (1999) https://doi.org/10.1117/12.361268
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
Abstract
The technology of microelectronics that has evolved over the past half century is one of great power and sophistication and can now be extended to many applications (MEMS and MOEMS) other than electronics. An interesting application of MEMS quantum devices is the detection of electromagnetic radiation. The operation principle of MEMS quantum devices is based on the photoinduced stress in semiconductors, and the photon detection results from the measurement of the photoinduced bending. These devices can be described as micromechanical photon detectors. In this work, we have developed a technique for simulating electronic stresses using finite element analysis. We have used our technique to model the response of micromechanical photon devices to external stimuli and compared these results with experimental data. Material properties, geometry, and bimaterial design play an important role in the performance of micromechanical photon detectors. We have modeled these effects using finite element analysis and included the effects of bimaterial thickness coating, effective length of the device, width, and thickness.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Boyd M. Evans, D. W. Schonberger, Panos G. Datskos, "Finite element modeling of micromachined MEMS photon devices", Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); doi: 10.1117/12.361268; https://doi.org/10.1117/12.361268
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