18 August 1999 Characterization of nonplanar motion in MEMS involving scanning laser interferometry
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Proceedings Volume 3880, MEMS Reliability for Critical and Space Applications; (1999) https://doi.org/10.1117/12.359370
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States
A study to evaluate three processes used for the release of standard devices produced by MCNC using the MUMPS process was undertaken by Jet Propulsion Laboratory with the collaboration of The Aerospace Corporation, and Polytec PI. The processes used were developed at various laboratories and are commonly the final step in the production of micro- electro-mechanical systems prior to packaging. It is at this stage of the process when the devices become extremely delicate and are subject to yield losses due to handling errors or the phenomenon of stiction. The effects of post processing with HF on gain boundaries and subsequent thermal processing producing native oxide growth during packaging will require further investigation.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Russell A. Lawton, Russell A. Lawton, Margaret H. Abraham, Margaret H. Abraham, Eric Lawrence, Eric Lawrence, "Characterization of nonplanar motion in MEMS involving scanning laser interferometry", Proc. SPIE 3880, MEMS Reliability for Critical and Space Applications, (18 August 1999); doi: 10.1117/12.359370; https://doi.org/10.1117/12.359370


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