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Optimal control strategy using linear programming for load disturbance compensation in thermal processing systems
Spatially programmable temperature control and measurement for chemically amplified photoresist processing
Polysilicon planarization and plug recess etching in a decoupled plasma source chamber using two endpoint techniques
Improved metal CMP endpoint control by monitoring carrier speed controller output or pad temperature
Extending ellipsometry capabilities for ultrathin gate oxide metrology using rapid optical surface treatment technology
Characterization of PECVD Ti process and development of a plasma-less chlorine clean for process repeatability in advanced DRAM manufacturing
New optical sensor for real-time in-situ end point monitoring during dry etching of III-V ternary multistack layers