Low open area multilayered dielectic film etch endpoint detection using EndPoint Plus

Norm D. Wodecki

doi:10.1117/12.361313

3 September 1999 Low open area multilayered dielectic film etch endpoint detection using EndPoint Plus

Norm D. Wodecki

Proceedings Volume 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V; (1999) https://doi.org/10.1117/12.361313
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

EndPoint Plus (EPP), a remote PC-based endpoint system, coupled to a Lam Research Corporation 200 mm Rainbow 4520 dielectric etch system, reliably detected etch endpoints of low exposure area (less than 3%) dielectric films. A narrow- bandwidth sampling of etch plasma emission spectra is monitored and processed to enhance detection of small spectral changes associated with the elimination of an etched film. Reliable and repeatable endpoint markers of low exposure, multi-layered films is demonstrated during a mini-marathon in a production environment.

Citation Download Citation

Norm D. Wodecki "Low open area multilayered dielectic film etch endpoint detection using EndPoint Plus", Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); https://doi.org/10.1117/12.361313

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