3 September 1999 Low open area multilayered dielectic film etch endpoint detection using EndPoint Plus
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Abstract
EndPoint Plus (EPP), a remote PC-based endpoint system, coupled to a Lam Research Corporation 200 mm Rainbow 4520 dielectric etch system, reliably detected etch endpoints of low exposure area (less than 3%) dielectric films. A narrow- bandwidth sampling of etch plasma emission spectra is monitored and processed to enhance detection of small spectral changes associated with the elimination of an etched film. Reliable and repeatable endpoint markers of low exposure, multi-layered films is demonstrated during a mini-marathon in a production environment.
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Norm D. Wodecki, Norm D. Wodecki, } "Low open area multilayered dielectic film etch endpoint detection using EndPoint Plus", Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); doi: 10.1117/12.361313; https://doi.org/10.1117/12.361313
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