3 September 1999 Reduced cost of ownership process for PECVD dielectric 1 and hardmask
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Abstract
Ceramic susceptors were retrofitted into the 200 mm Plasma Enhanced Chemical Vapor Deposition (PECVD) Dielectric toolsets to increase the Mean Time Before Failure (MTBF) caused by warping of the original Aluminum susceptors. Although the hardware retrofit resulted in a more stable deposition process, the within wafer uniformity remained consistently high. Designed experiments were performed and determined that the new Ceramic susceptors exhibited a uniformity signature that enabled the process to be optimized using electrode spacing. This process change resulted in a 20% uniformity improvement on both control and product wafers without adversely affecting Yield and IV parameters. Effects of the change on various other deposition parameters were also studied and determined to be minimal. After committee review, this process change was implemented on all PECVD Dielectric 1 toolsets and has been stable over time.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jonathon M. Lobbins, Leonard J. Olmer, "Reduced cost of ownership process for PECVD dielectric 1 and hardmask", Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); doi: 10.1117/12.361296; https://doi.org/10.1117/12.361296
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KEYWORDS
Ceramics

Semiconducting wafers

Plasma enhanced chemical vapor deposition

Dielectrics

Aluminum

Boron

Electrodes

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