Ultrathin integrated ion metal plasma titanium and metallorganic titanium nitride liners for sub 0.18 um W based metallization schemes for >500 MHz microprocessors

Nitin Khurana; Vikram Pavate; Michael Jackson; T. Mandrekar; Z. Fang; Anish Tolia; H. Luo; Jason Li; Rod Mosely; Murali K. Narasimhan; Mei Chang; Fusen E. Chen

doi:10.1117/12.360579

11 August 1999 Ultrathin integrated ion metal plasma titanium and metallorganic titanium nitride liners for sub 0.18 μm W based metallization schemes for >500 MHz microprocessors

Nitin Khurana, Vikram Pavate, Michael Jackson, T. Mandrekar, Z. Fang, Anish Tolia, H. Luo, Jason Li, Rod Mosely, Murali K. Narasimhan, Mei Chang, Fusen E. Chen

Author Affiliations +

Proceedings Volume 3883, Multilevel Interconnect Technology III; (1999) https://doi.org/10.1117/12.360579
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

This study will specifically address the results of integrating IMP Ti and MOCVD TiN on a high vacuum system. Results of design of experiments used for process characterization and optimizing device parametric such as contact and via resistance will be discussed, in particular with respect to unlanded via schemes. Finally, Cost of Ownership calculations will be presented in comparison to conventional PVD technologies. In summary, the integration of IMP Ti and MOCVD TiN enables the deposition of a highly cost effective, low resistivity, ultra-thin, and low- temperature liners for sub 0.18 micrometers technology node thereby enabling > 500 MHz microprocessor technology.

Citation Download Citation

Nitin Khurana, Vikram Pavate, Michael Jackson, T. Mandrekar, Z. Fang, Anish Tolia, H. Luo, Jason Li, Rod Mosely, Murali K. Narasimhan, Mei Chang, and Fusen E. Chen "Ultrathin integrated ion metal plasma titanium and metallorganic titanium nitride liners for sub 0.18 μm W based metallization schemes for >500 MHz microprocessors", Proc. SPIE 3883, Multilevel Interconnect Technology III, (11 August 1999); https://doi.org/10.1117/12.360579

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available