27 August 1999 Failure analysis of wafer-level reliability testing failure
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Wafer-level reliability (WLR) testing is an important tool that is used during the productization phase to investigate the reliability performance of devices and materials before full qualification cycle. The rapid nature of the WLR testing permits the process engineer to evaluate process variation and to obtain almost instantaneous feedback about its reliability impact. Fast reliability feedback is essential to help the process engineer build reliability into our product during the productization phase. Understand the root cause and failure mechanism after WLR testing, failure analysis plays a very important role. This paper describes the fundamental requirements for failure analysis equipment needed, the failure analysis and preparatory techniques used to locate the failure sites and cases study will be presented.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chong Khiam Oh, Chong Khiam Oh, Soh Ping Neo, Soh Ping Neo, Jian Hua Bi, Jian Hua Bi, Zong Min Wu, Zong Min Wu, Lian Choo Goh, Lian Choo Goh, Shailesh Redkar, Shailesh Redkar, "Failure analysis of wafer-level reliability testing failure", Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); doi: 10.1117/12.361354; https://doi.org/10.1117/12.361354

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