In-line monitoring of chemical-mechanical polishing processes

Dale L. Hetherington; David J. Stein

doi:10.1117/12.361329

27 August 1999 In-line monitoring of chemical-mechanical polishing processes

Dale L. Hetherington, David J. Stein

Proceedings Volume 3884, In-Line Methods and Monitors for Process and Yield Improvement; (1999) https://doi.org/10.1117/12.361329
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

We present an overview of in-line monitoring of chemical- mechanical polishing (CMP) processes. We discuss the technical challenges and review many of the approaches that have been published. Several methods are currently under investigation including optical, thermal (pad temperature), friction (torque motor current), electrochemical, and acoustic (vibration).

Citation Download Citation

Dale L. Hetherington and David J. Stein "In-line monitoring of chemical-mechanical polishing processes", Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); https://doi.org/10.1117/12.361329

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