1 February 2000 Polymer ablation by ultrashort pulsed lasers
Author Affiliations +
Proceedings Volume 3885, High-Power Laser Ablation II; (2000); doi: 10.1117/12.376991
Event: Advanced High-Power Lasers and Applications, 1999, Osaka, Japan
Abstract
In this paper, we study the ablation behavior of polyetheretherketone polymer samples of 100 micrometers thickness when irradiated with visible laser light of 445 nm wavelength and 200 fs pulse width at 82 MHz pulse repetition rate. Etch depths corresponding to a particular laser power were measured at room temperature in open air, by counting the number of pulses required to perforate the sample. The laser focal spot size has been measured to be 0.03 mm2 and was kept constant during the experiment. The surface topology of the polymer samples was investigated by Atomic Force Microscopy in the continuous contact mode. The obtained Atomic Force Microscopy images revealed no mechanical damage in the inner ablation crater wall. Plots of the ablation rate as a function of the laser power, both in a linear and a logarithmic scale, show a large deviation from a straight line. These findings along with the high average power and suggest that Multiphoton Dissociation is the predominant mechanism responsible for ablation in this experiment.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alexander A. Serafetinides, Mersini I. Makropoulou, Ajoy Kumar Kar, Constantine D. Skordoulis, "Polymer ablation by ultrashort pulsed lasers", Proc. SPIE 3885, High-Power Laser Ablation II, (1 February 2000); doi: 10.1117/12.376991; https://doi.org/10.1117/12.376991
PROCEEDINGS
7 PAGES


SHARE
KEYWORDS
Laser ablation

Polymers

Pulsed laser operation

Atomic force microscopy

Picosecond phenomena

Absorption

Etching

Back to Top