7 February 2000 Laser perforator
Author Affiliations +
Proceedings Volume 3888, High-Power Lasers in Manufacturing; (2000) https://doi.org/10.1117/12.377079
Event: Advanced High-Power Lasers and Applications, 1999, Osaka, Japan
Laser equipment for the perforation of documents and securities is presented. This laser perforator (LP) differs by extended precision of perforation, high processing velocity, perfected automatic control. LP's operation is based on the preliminary theoretical and experimental research of laser irradiation and paper or/and organic tissue interaction. The results of CO2-laser irradiation action upon different materials and samples of documents allowed to determine system requirements to LP. Developed LP is destined for perforation of paper documents with jackets with total thickness from 0.5 to 4 mm. Processing document, LP makes more than 100 conical perforation holes that improve protection rate of document. LP guarantees perforation time less than 3 sec, document's blank positioning precision plus or minus 0.2 mm, laser beam positioning precision plus or minus 0.01 mm. Due to the system parameters optimization it became possible to eliminate a singeing of hole edge, that improved perforation quality. Developed LP consists of laser-module, technological module, laser cooling module and automatic control system. Laser module includes continuous Q-switched CO2-laser, scanner, power supply, controller, chopper. Technological module has X- Y-table, conveyer for blanks of documents, pneumatic block. Automatic control system, which includes two video cameras, illuminators, controller, PC, gives a possibility to control holes disposition in a matrix and to identify perforated number.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sergey N. Kiyanitsa, Sergey N. Kiyanitsa, Yury E. Bezrodny, Yury E. Bezrodny, Sergey B. Kononov, Sergey B. Kononov, Vita V. Ivanova, Vita V. Ivanova, } "Laser perforator", Proc. SPIE 3888, High-Power Lasers in Manufacturing, (7 February 2000); doi: 10.1117/12.377079; https://doi.org/10.1117/12.377079

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