29 September 1999 Micromachined accelerometer based on electron tunneling
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In this paper, a new micromachined tunneling accelerometer is described. Using the bulk-silicon fabrication technology and the silicon/glass electrostatic bonding process, a sandwich structure tunneling accelerometer has been fabricated and tested. In order to reduce the low frequency noise, the feedback circuit has been improved by adding oscillator and demodulator. The first prototype has a resolution of approximately 1e-6g/ (root) Hz and can survive with at least 50g shocking.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yongjun Yang, Yongjun Yang, Lijie Li, Lijie Li, Yongqing Xu, Yongqing Xu, Yanjun Zhao, Yanjun Zhao, Chun-Guang Liang, Chun-Guang Liang, Tongli Wei, Tongli Wei, } "Micromachined accelerometer based on electron tunneling", Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); doi: 10.1117/12.364473; https://doi.org/10.1117/12.364473


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