29 September 1999 Surface-micromachined electrostatic diaphragm micropump
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Abstract
An electrostatic diaphragm micropump for fluids and gases has been designed and fabricated by silicon surface micromachining. Diaphragm structures are bridge-type, cantilever-type and fan-type polysilicon, and sacrificial layers are low-temperatures oxide on polysilicon substrates. The developed anhydrous HF gas-phase etching of sacrificial oxide on polysilicon substrates has been employed to release polysilicon microstructures. The fabricated micropump with size of the order of 1 mm2 operates at square wave voltage of 10V and 2Hz under near room temperature and normal atmospheric pressure.
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Won-Ick Jang, Won-Ick Jang, Yong Il Lee, Yong Il Lee, Chang-Auck Choi, Chang-Auck Choi, Chi-Hoon Jun, Chi-Hoon Jun, Youn Tae Kim, Youn Tae Kim, } "Surface-micromachined electrostatic diaphragm micropump", Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); doi: 10.1117/12.364469; https://doi.org/10.1117/12.364469
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