1 October 1999 3D micromachined devices based on polyimide joint technology
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Abstract
A novel and simple technology for making robust 3D silicon structures with small radii of bending has been developed and investigated. The proposed self-assembling method of bending 3D structure out-of-plane, without the use of interlocking braces is based on thermal shrinkage of polyimide in V-grooves. The static bending angle for the permanent out-of-plane rotated structure can be chosen and well controlled over a wide range by varying the curing temperature of the polyimide and the number of V-grooves in the joint.
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Thorbjoern Ebefors, Johan Ulfstedt-Mattsson, Edvard Kaelvesten, Goeran Stemme, "3D micromachined devices based on polyimide joint technology", Proc. SPIE 3892, Device and Process Technologies for MEMS and Microelectronics, (1 October 1999); doi: 10.1117/12.364509; https://doi.org/10.1117/12.364509
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