Lithographic definition of channel and void structures in multilayer PZT microactuators

Tobias Rosqvist; Stefan A. I. Johansson

doi:10.1117/12.364485

1 October 1999 Lithographic definition of channel and void structures in multilayer PZT microactuators

Tobias Rosqvist, Stefan A. I. Johansson

Proceedings Volume 3892, Device and Process Technologies for MEMS and Microelectronics; (1999) https://doi.org/10.1117/12.364485
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia

Abstract

We are investigating techniques to fabricate advanced microactuators cost efficiently and in particular to combine silicon microstructures with multilayer PZT microelements. Aiming at an increased freedom in design of multilayer PZT elements, various process steps to build channel and void structures in the actuator body are investigated. In a multilayer actuator, channels and voids can be used for transportation of fluids or to change transducer properties. A PZT green ceramic body is built with internal sacrificial structures defined using photolithography and patterned polymer foil and these structures are removed during binder burnout. In difference to conventional green tape lamination the technique used in the presented experiments, wet building, tends to planarize consecutive layers cast. This is particularly advantageous for high aspect ratio sacrificial structures. Results show that possible channel dimensions range from 10 micrometers up to above 200 micrometers . The lower channel dimension limitation is determined by the surface roughness of a cast green layer and the grain growth during sintering. No sagging of the channels is observed at the investigated channel dimensions. The mechanical and chemical stability of the sacrificial material during exposure to solvent and moderate heat is found to be important. The large scale manufacturing aspect of the investigated technique is also discussed.

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Tobias Rosqvist and Stefan A. I. Johansson "Lithographic definition of channel and void structures in multilayer PZT microactuators", Proc. SPIE 3892, Device and Process Technologies for MEMS and Microelectronics, (1 October 1999); https://doi.org/10.1117/12.364485

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KEYWORDS

Ceramics

Ferroelectric materials

Lithography

Polymers

Chemical elements

Microactuators

Silicon

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