8 October 1999 Sandwich-type structure for economical MEMS and MOEMS assembly
Author Affiliations +
Abstract
A new fabrication method suitable for cheap assembling of MEMS and MOEMS is described. As a present, the very expensive methods for assembling and packaging, applied in the case of MEMS and MOEMS, make almost prohibit the final cost of a new prototype. For this reason it is so important to reduce the prize of the assembling techniques, and to find a way for batch mounting and packaging. The proposed method consists of generating a high aspect ratio structure, by means of soldering some different shaped metallic foils. The technological process consists of the following steps. In the first step, the desired 3D structure is divided into N different levels, while maintaining the thickness of each of them between 10-300 micrometers. Next, the pattern for each level is achieved by applying, to the copper metallic substrates, a double side lithography, commonly used in printed circuits fabrication, such as: solid negative resist lamination; UV exposure; alkaline spray developing, and acid spray etching. After a double side Sn-Pb electroplating of each metallic foil, all of them are properly stacked and aligned in a frame, by means of some special etched holes. The resulting stack is pressed and heated at soldering alloy's melting temperature, preferably by using a vacuum system. Finally, the temperature is ramped down and the pressure is released, resulting in the desired 3D arbitrary shaped sandwich type structure. This new technique opens wide perspectives to replace some expensive assembling methods, in a variety of prototypes containing MEMS and MOEMS, being also recommended for metal can packaging in special applications and microfluidic devices assembling too.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Niculae Dumbravescu, Niculae Dumbravescu, } "Sandwich-type structure for economical MEMS and MOEMS assembly", Proc. SPIE 3893, Design, Characterization, and Packaging for MEMS and Microelectronics, (8 October 1999); doi: 10.1117/12.368459; https://doi.org/10.1117/12.368459
PROCEEDINGS
8 PAGES


SHARE
Back to Top